23/01/2026
NVIDIA GB200/GB300 Server Cold Plate Liquid Cooling Radiator
Technical Specifications
Core structure: Single-chip independent cold plate (compatible with B300 GPU) + 3D printed titanium alloy microchannels (channel width < 0.3mm);
Thermal interface: Gallium-based liquid metal adopted (thermal conductivity 73 W/m·K), thermal resistance as low as 0.02 cm²·K/W;
Cooling capacity: Single cold plate heat dissipation up to 1400W, total cooling capacity of full system (72GPU) exceeding 100kW;
Fluid parameters: Compatible with PG25 coolant/deionized water, flow rate 2–4 m/s, pressure resistance ≥10 bar;
Connectors: Equipped with NVUQD03 quick connectors (1/3 the size of previous generation), 252 pairs configured for single system.
Application Fields
AI data centers: GB300 NVL72 rack-level AI servers (supporting large language model inference/training);
Supercomputing/HPC: Large-scale parallel computing tasks (e.g., scientific simulation, quantum computing assistance);
High-density computing scenarios: Modular computing units such as Meta Clemente 1U 4GPU computing trays.