Kanghongjin - SMT Splice Tape, Shenzhen, Shenzhen (2026)

24/10/2025

How Small Can an SMT Pick-and-Place Machine Mount?
Kanghongjin.com
How Small Can an SMT Pick-and-Place Machine Mount? Precision and Technical Limits Explained
As electronic products continue to evolve toward miniaturization and high integration, the size of electronic components is becoming smaller and smaller. This trend places higher demands on the precision and stability of SMT pick-and-place machines. So, how small can an SMT pick-and-place machine actually mount?

1. Main Mounting Size Range
The smallest component size that an SMT pick-and-place machine can handle varies depending on the brand, model, and configuration.
Currently, 01005 (0.4×0.2 mm) components represent the mainstream precision limit for most production-grade SMT equipment.
Some top-tier machines can even support 008004 (0.25×0.125 mm) components, but these require extremely stable environments, fine-tuned processes, and highly skilled operation.

2. Key Factors Affecting Minimum Mounting Size
Machine Precision and Speed
High-precision pick-and-place machines achieve ±25 μm placement accuracy.
Speed and precision must be balanced — the smaller the component, the slower the placement rate.
Vision System Performance
High-resolution cameras and intelligent recognition algorithms ensure accurate component positioning.
Proper lighting and angle detection are critical for 01005-level components.
Nozzle and Vacuum System Design
Micro-nozzles must provide sufficient vacuum force without damaging components.
Frequent nozzle cleaning is essential to prevent clogging and mispicks.
PCB and Stencil Precision
Pad design must comply strictly with IPC standards.
Stencil thickness and aperture design directly affect solder paste volume.
Production Environment Control
Temperature and humidity fluctuations affect static and pick-up performance.
For 01005-level components, a constant temperature and humidity environment is essential.
3. Industry Trends and Future Development
With the rapid growth of 5G, wearable devices, automotive electronics, and medical technology, micro-sized components (01005 and smaller) are increasingly common.
Future advancements in SMT technology will focus on:

20/09/2025

Can SMT Double Splicing Tape Ensure Firm Adhesion Without Peeling Off?
Comprehensive Analysis and Advantage Explanation
Kanghongjin.com

In SMT (Surface Mount Technology) production, splicing is a critical step to ensure production continuity and improve efficiency. The use of double-sided splicing tape has become increasingly popular on production lines due to its simplicity and high efficiency. However, the key concern for engineers and purchasers remains: Can double-sided splicing tape truly guarantee firm adhesion without peeling off?

1. Core Factors of Firmness
From a material perspective, the performance of double-sided splicing tape primarily depends on the adhesive formulation and the strength of the base material. High-quality tapes use industrial-grade adhesives with strong tack, high temperature resistance, and humidity resistance. Such tapes maintain stable adhesion during high-speed operation and long production cycles, effectively preventing tape breakage or lifting. In contrast, ordinary tapes often rely only on initial tack, and may lose adhesion within hours, leading to production interruptions.

2. Impact of Operation and Environment
Firm adhesion is not determined solely by product quality, but also by operating practices and environmental conditions. If the carrier tape ends are not properly trimmed, or if dust and oil residues are present, adhesive performance will be compromised. In addition, in high-temperature or high-humidity environments, inferior tapes tend to fail quickly. Our product, however, has undergone repeated testing and maintains stable adhesion within a wide temperature and humidity range of -10℃ to 60℃, greatly enhancing environmental adaptability.

KangHongJing is a professional production and sales factory. I hope it can help you. If you want to know more about SMT assembly information, you can follow the updates of KangHongJing.

WhatsApp/Tel/WeChat: +86 135 3057 5115 E-mail: [email protected] Facebook：135 3057 5115
Shenzhen Kanghongjin Electronics Co., Ltd.

23/08/2025

What is the development prospect of SMT?
Kanghongjin.com
Market Size and Growth Outlook
Significant Market Expansion

According to data from Markets and Markets, the SMT market is projected to grow from approximately USD 5.8 billion in 2023 to USD 8.4 billion by 2028, with a compound annual growth rate (CAGR) of about 7.8%.
Another report indicates that the global SMT market size in 2024 will be around USD 5.5 billion and is expected to reach USD 8.73 billion by 2030, with a CAGR of about 8%.
According to Verified Market Reports, the SMT equipment market was valued at USD 5.7 billion in 2023 and is expected to increase to USD 13.6 billion by 2030, with a CAGR of 11.5%.
Over the next decade, the SMT market will maintain steady growth, with the equipment segment anticipated to achieve the strongest expansion.

15/08/2025

What is the difference between colors of splicing tape?
Kanghongjin.com
The yellow, blue, and green colors of SMT splicing tape aren’t simply aesthetically pleasing. In the industry, they typically serve the following purposes or distinctions:
1. Mainly used to distinguish materials or processes

Yellow: The most common color, universally used regardless of material type or machine model.

Blue: Some factories use this color to mark special batches, sample sheets, or materials from specific production lines.

Green: Commonly used for environmental labeling, RoHS materials, or to identify specific production lines.

2. Distinguishing Widths and Specifications

Some manufacturers use colors to represent tape widths (e.g., 8mm yellow, 12mm blue, 16mm green) to facilitate warehousing and quick material sorting.

However, different brands have different definitions, so specifications cannot be determined solely by color.

3. Distinguishing Tackiness

A few high-end brands use color to distinguish tackiness strength, for example, yellow for standard tack, blue for high tack, and green for low tack (suitable for paper tape).

This method is more common in Japanese, European, and American supply chains, but is less standardized in China.

4. The difference is purely cosmetic.

Some splicing tape manufacturers simply offer a variety of colors to facilitate customization based on customer preferences or company image, without any performance differences.

Summary:

Color itself does not necessarily determine performance; it is more for production management convenience.

When purchasing, prioritize the tape’s adhesion, thickness, tensile strength, and compatibility with the tape, rather than color.

If your production line uses color for batch/specification identification, it is recommended to confirm with the manufacturer whether the color meanings are fixed before purchasing.

WhatsApp/Tel/WeChat: +86 135 3057 5115 E-mail: [email protected] Facebook：135 3057 5115
Shenzhen Kanghongjin Electronics Co., Ltd.

09/08/2025

Surface Mounted Technology
kanghongjin.com
SMT stands for Surface Mounted Technology, which is currently the most popular technology and process in the electronics assembly industry.
SMT assembly refers to the series of processing steps performed on the basis of a PCB.
PCB stands for Printed Circuit Board.

Process: The basic SMT process flow includes:
Solder paste printing → Component placement → Curing → Reflow soldering → AOI optical inspection → Repair → Depaneling → Deburring → Cleaning.

Solder Paste Printing
Purpose: To apply solder paste onto the PCB pads, preparing for component soldering.
Equipment: Screen printer, located at the very front of the SMT production line.
Component Placement
Purpose: To accurately mount surface-mounted components onto their designated positions on the PCB.
Equipment: Pick-and-place machine, positioned after the screen printer in the SMT production line.
Curing
Purpose: To melt the adhesive so that surface-mounted components are firmly bonded to the PCB.
Equipment: Curing oven, located after the placement machine in the SMT line.
Reflow Soldering
Purpose: To melt the solder paste so that components are securely soldered to the PCB.
Equipment: Reflow oven, positioned after the placement machine.
AOI (Automated Optical Inspection)
Purpose: To inspect the soldering quality and assembly quality of assembled PCBs.
Equipment: Automated optical inspection system (AOI). For orders exceeding tens of thousands, AOI is commonly used; for smaller orders, manual inspection is applied. The AOI can be positioned as needed, either before or after reflow soldering.
Repair
Purpose: To rework PCBs that fail inspection.
Tools: Soldering irons, rework stations, etc., usually located after the AOI.
Depaneling
Purpose: To separate multi-panel PCBs into individual units, typically using V-cut or machine cutting methods.
Deburring
Purpose: To smooth and flatten any burrs on the PCB edges.
Cleaning

WhatsApp/Tel/WeChat: +86 135 3057 5115 E-mail: [email protected] Facebook：135 3057 5115

01/08/2025

Introduction to the SMT Process
The SMT (Surface Mount Technology) process includes several key steps: material preparation and loading, solder paste printing, solder paste inspection, component placement, reflow soldering, inspection, and rework.

SMT Process Overview:
1. Basic Terminology in SMT
SMT (Surface Mounted Technology): A popular technology and process in the electronics assembly industry, where components are mounted directly onto the surface of printed circuit boards (PCBs).
AOI (Automatic Optical Inspection): A device that uses optical principles to detect common defects in the soldering process. The machine automatically scans the PCB using a camera, captures images, and compares the solder joints with qualified standards in the database. Through image processing, it identifies any defects and displays them on a monitor or marks them for repair.
SPI (Solder Paste Inspection): A machine that inspects the solder paste printed on PCBs using 3D laser scanning. It measures height, area, volume, offset, tailing, solder volume variation, and the presence of foreign materials.
2. Basic SMT Operating Knowledge
Standard environmental conditions in an SMT workshop: temperature between 18–26°C, humidity between 30–70%.
ESD wrist straps and ESD gloves or finger cots must be worn before handling PCBA.
Vacuum packaging of PCBs is used to prevent dust and moisture.
If the humidity indicator on IC packaging shows more than 30% after opening, the IC is considered moisture-exposed.
When baking ICs, refer to the component’s moisture sensitivity level (MSL) and tray heat resistance.
PCB warpage should not exceed 0.7% of its diagonal length.
All materials, equipment, fixtures, and instruments must have clear status labeling and be categorized accordingly.
If any product drops during production or inspection, it must be sent back to the first inspection station for full PCBA retesting.

WhatsApp/Tel/WeChat: +86 135 3057 5115 E-mail: [email protected] Facebook：135 3057 5115

Shenzhen Kanghongjin Electronics Co., Ltd.

18/07/2025

SMT Pick-and-Place Machine Errors After Splicing – Troubleshooting Guide
Kanghongjin.com

1. Reel Misalignment
Issue: Incorrect pick or placement.
Fix: Recheck reel alignment and ensure proper tension.

2. Feeder/Tape Problems
Issue: No component or misfeed.
Fix: Inspect tape for damage, realign, and check feeder tension.

3. Component Mismatch
Issue: Wrong component picked or missed.
Fix: Verify the new reel’s part number and ensure uniform component size.

4. Machine Configuration Errors
Issue: Operational failure post-splice.
Fix: Reset machine, check program settings, and ensure correct part data.

5. Pick-up Arm Issues
Issue: Arm fails to pick components.
Fix: Align arm and ensure smooth tape feeding.

6. No Component Detected
Issue: “No component detected” error.
Fix: Check splice for smooth tape and calibrate sensors.

7. Component Jamming
Issue: Jamming in feeder.
Fix: Clean feeder and ensure smooth tape feeding.

8. Inconsistent Placement
Issue: Inaccurate placement.
Fix: Recheck tape alignment, and recalibrate machine placement.

9. Sensor Issues
Issue: Sensor failure or misreads.
Fix: Clean and realign sensors.

10. Weak Splice
Issue: Tape separation or failure to pick parts.
Fix: Ensure splice is secure and use proper splicing materials.

WhatsApp/Tel/WeChat: +86 135 3057 5115 E-mail: [email protected] Facebook：135 3057 5115
Shenzhen Kanghongjin Electronics Co., Ltd.

12/07/2025

Solder Paste Mixer: The Invisible Guardian of High-Reliability SMT Soldering
Kanghongjin.com

I. Material Properties: Solder Paste is a “Living” Substance
1. Separation is a Physical Inevitability
The metal powder in solder paste has a density of 7.4 g/cm³, nine times that of the flux (0.8 g/cm³). Over time, separation is inevitable:

Metal particles settle → alloy ratio imbalance at solder joints, uneven IMC layer thickness (measured deviations up to 40%)
Flux rises → loss of active agents, reduced oxidation resistance (copper foil oxidation rate increases by 300%)

2. Irreversible Thixotropy Degradation
Frozen storage collapses the thixotropic agent’s mesh structure in the flux:
Viscosity spikes from 800 kcps (factory) to 2000 kcps
Poor leveling → aperture fill rate on fine-pitch stencils drops below 60%
“Stringing” during release (fine-pitch print yield drops 35%)
II. The Primitive Flaws of Manual Mixing
1. Deadly Air Entrapment
Manual scraping and stirring inevitably trap air:

Forms bubbles 50–200 μm in diameter → expands 1200× during reflow
Explosions create solder balls (5+ per cm² = defect)
Micro-voids (BGA void rate >15% = failure)
2. Hidden Disaster: Particle Breakage
Manual pressure crushes metal particles:

25 μm Type-4 particles develop sharp edges
Surface area increases 50% → oxidation rate rises exponentially
Wetting drops 30% (spread area falls from 80% to 56%)
3. Consistency Chaos on the Line
Operator-dependent force and time introduce massive variance:

Viscosity fluctuations ±35% (machine mixing ±5%)
Solder joint strength on same batch PCBA varies by up to 48%
Process capability index Cpk < 0.8 (automotive electronics require Cpk ≥ 1.67)
III. The Scientific Superiority of Equipment Mixing
1. 3D Spatial Recombination Technology
Combination of revolution and rotation:

Revolution (>200 G) disperses metal clusters
Rotation applies shear force to strip oxide layers
Vacuum (-0.08 MPa) removes microbubbles
2. Precise Rheology Recovery
Viscosity monitoring > Torque feedback > Dynamic parameter tuning > Output: 800 ± 40 kcps
Restores thixotropic agent’s mesh structure and shear-thinning behavior.

04/07/2025

Do stencil wiping papers shed lint? Can they cause secondary contamination?
Kanghongjin.com

Yes — lint shedding from stencil wiping paper can easily cause secondary contamination. The impact depends on the product’s quality, the precision level of the application, and the required cleanliness standards.

Will high-quality stencil wiping paper shed lint or cause contamination?
No. Premium stencil wiping papers are designed not to shed lint and will not cause secondary contamination.

Why does stencil wiping paper shed lint?
Material Determines Cleanliness
High-end wiping paper is typically made of high-strength non-woven fabric (e.g. wood pulp + polyester fiber), and undergoes specialized processing such as:
Hot calendering: Increases fiber bonding strength to prevent lint shedding
Surface smoothing: Minimizes dust residue
Low particle emission: Meets cleanroom or electronics-grade requirements
Reinforced Structural Design
The paper is engineered with multi-layer composite construction featuring:
High absorbency: Efficiently absorbs solvents with no residue
High durability: Resistant to tearing even under high-speed printing conditions
Tested & Certified Cleanliness
Premium products usually pass:
ROHS or ISO certifications
Ion contamination tests
Particle release evaluations

Risks of Using Low-Quality Wiping Paper:
Stencil Aperture Contamination
Fiber debris may clog stencil apertures, affecting solder paste transfer and causing printing defects (e.g. insufficient paste, bridging, or missing deposits).
Solder Paste Contamination
Loose fibers can mix into solder paste, altering its flow characteristics and leading to defects such as cold solder joints or solder bridges.
Contamination of PCB Pads or Components
Dust and lint falling onto PCB pads may cause poor wetting, oxidation of solder joints, or even short circuits.
Interference with Cleaning Agents
Some fiber materials may react with cleaning agents like IPA or alcohol, swell, and release more particulates — worsening contamination.

WhatsApp/Tel/WeChat: +86 135 3057 5115 E-mail: [email protected] Facebook：135 3057 5115
Shenzhen Kanghongjin Electronics Co., Ltd.

28/06/2025

Common Defects in SMT Solder Paste Printing and Improvement Measures
Kanghongjin.com
In SMT solder paste printing, ensuring print quality is a complex task. Defects may originate from several interconnected factors, including equipment calibration, stencil design, solder paste characteristics, workshop environment, and operator handling.
1. Solder Paste Slumping
Definition:
Solder paste fails to maintain a stable shape, causing the edges to collapse and flow outside the pad area. It may even bridge adjacent pads, leading to solder shorts.

Causes and Countermeasures:

1: Excessive squeegee pressure compresses the solder paste, causing it to flow through stencil apertures into adjacent pad areas.
Improvement: Reduce squeegee pressure.
2: Solder paste viscosity is too low to retain the intended printed shape.
Improvement: Use solder paste with higher viscosity.
3: Solder powder is too fine. While smaller powder offers better release, it compromises shape retention.
Improvement: Use solder paste with larger solder powder particles.
2. Solder Paste Misalignment
Definition:
Printed solder paste is not properly aligned with the intended pad area. This may cause solder bridging or printing on the solder mask, potentially resulting in solder balls.

Causes and Countermeasures:

1: PCB is not adequately supported or clamped, leading to misalignment between stencil apertures and pads during printing.
Improvement: Use multi-point clamping to fix the PCB securely.
2: Mismatch between the PCB and stencil, possibly due to poor stencil aperture quality or misalignment with pad locations.
Improvement: Recreate the stencil with precise aperture alignment.

–
KangHongJing is a professional production and sales factory. I hope it can help you. If you want to know more about SMT assembly information, you can follow the updates of KangHongJing.

WhatsApp/Tel/WeChat: +86 135 3057 5115 E-mail: [email protected] Facebook：135 3057 5115

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