Easybuyic Electronics

06/06/2023

Nvidia, TSMC underestimate GPU demand, sources say
TSMC produces Nvidia AI GPUs in a "super rush", and orders are full until the end of the year.

According to semiconductor equipment manufacturers, the main reason for Nvidia’s AI GPU shortage is that Nvidia and TSMC’s previous forecasts for annual production capacity and orders were quite conservative. Unexpectedly, the demand for HPC chips such as AI GPUs erupted, and the original CoWoS wet process with low production capacity was advanced. Encapsulation equipment is difficult to meet.
In addition, the delivery time of some packaging equipment and components is as long as 3 to 6 months, and the new production capacity will be slowly in place at the end of the year at the earliest, which means that the next six months will be out of stock. .

Wei Zhejia, president of TSMC, also revealed for the first time that he recently had a conference call with a customer and asked to expand CoWoS orders.

05/06/2023

According to Japan's Kyodo News, Japanese memory chip manufacturer Kioxia and its partner Western Digital Corporation (WD) have entered into the final stage of coordination for business mergers, and the semiconductor memory business will reach the largest scale in the world.

According to reports, due to the deterioration of the semiconductor market for smartphones and other products and the sluggish performance, the move by both parties is intended to improve operating efficiency and competitiveness.

The merger may affect the business restructuring plan of Toshiba, which invested 40% of Kioxia. Omdia, a British research company, said that if merged, the sales of the business will reach 2.5 trillion yen (about 130 billion yuan), rivaling the global leader Samsung Electronics of South Korea.

02/06/2023

01/06/2023

JPMorgan Chase analyst Harlan Sur's research report pointed out that Broadcom's customized IC business continues to receive additional orders from Google to produce the AI chip TPU tensor processing unit developed by Google.
Sur mentioned that according to Broadcom, the revenue of customized cloud chips is expected to reach US$3 billion this year, and customers include Google, Microsoft and Meta.
Sur believes that with the increase in Google's order volume, only Google's TPU orders can bring revenue contribution to Broadcom's revenue of 3 billion US dollars, or even more.

31/05/2023

According to a report released by Morgan Stanley, the automotive HPC semiconductor market will surge threefold in the next five years.
The overall potential market for wafer foundries in automotive HPC is estimated to be US$2 billion this year, and will grow to US$6 billion by 2027, with a CAGR of 29%.
At the same time, due to the growing demand for custom design of automotive HPC chips, the cumulative revenue of design service factories will increase by as much as US$2 billion in the next 5 years.
In addition, in 2022, only 7% (less than 6 million vehicles) of autonomous driving capabilities will reach Level 3 or higher; Morgan Stanley estimates that this proportion will increase to more than 20% (about 20 million vehicles) by 2027 .

29/05/2023

According to foreign media reports, senior U.S. and Japanese business officials have agreed to cooperate to explore the development of next-generation semiconductors.

U.S. Commerce Secretary Raimondo and Japanese Economy, Trade and Industry Minister Yasutoshi Nishimura met in Detroit on Friday local time and said they would encourage chip research centers in both countries to develop roadmaps for technology and human resource development, according to a joint statement.

According to Taiwan's "United Daily News", in response to the online rumor that MediaTek and Nvidia will announce a new alliance strategy next Monday (29th) to jointly attack Arm-based PCs and NB single-chips, MediaTek issued a serious message today saying that the outside world should not overdo it. Speculation, the actual cooperation plan will be announced next week.

26/05/2023

According to a TrendForce report, global demand for DRAM chips is expected to exceed supply as early as July, a change that will ease the pressure on semiconductor companies struggling due to chip downturns.

In addition, it is expected that global DRAM demand will exceed 105.4 billion 2GB chips this year, exceeding the estimated supply of 104.3 billion.

25/05/2023

"Korea Economic News" reported on May 23 that Japanese Minister of Economy:

Trade and Industry Yasutoshi Nishimura said in an interview that South Korea and Japan need to further strengthen the semiconductor supply chain.

Nishimura suggested strengthening supply chains to allow Japanese automakers and electronics companies to buy Korean chips made from Japanese parts and materials.

Yasutoshi Nishimura also said that he welcomes Samsung Electronics' plan to build a new R&D center in Japan, and the Japanese government will provide support so that Korean and Japanese companies can expand mutual investment and achieve a win-win situation.

Nishimura Yasutoshi said that if SK Hynix and other Korean semiconductor companies set up bases in Japan, the Japanese government will also consider providing subsidies.

24/05/2023

As the demand for silicon carbide chips continues to increase, it plans to acquire US chip maker TSI Semiconductor in the near future.

Bosch said that in the next few years, the company plans to invest more than $1.5 billion in TSI's plant in Roseville, California, USA, and transform TSI's semiconductor manufacturing facilities to the most advanced technology.

At the same time, Bosch will significantly expand its global silicon carbide chip product portfolio by the end of 2030.
The two companies have reached an agreement not to disclose any financial details of the transaction, which is subject to regulatory approval.

23/05/2023

On Monday local time,
Intel disclosed the latest details of the company's future strategic deployment of AI computing power at the High Performance Computing Exhibition held in Hamburg, Germany.

For Falcon Shores, the next-generation Max series GPU chip that is most concerned about in the market,
Intel gave a series of parameter forecasts on Monday: the high-bandwidth memory (HBM3) specification will reach 288GB and support 8bit floating-point operations.

It is worth mentioning that due to strategic transformation, the earliest time this chip will come out is 2025.

22/05/2023

Morning News:

19/05/2023

A US$39 billion semiconductor production project in the United States has received applications from more than 300 companies.

It is reported that as of this week, the CHIPS Program Office (CHIPS Program Office) has received more than 300 letters of intent, and the number announced in April was more than 200.

The applicants cover the entire semiconductor ecosystem, more than half of which are related to chip manufacturing and back-end packaging.