Global Success Circuits -PCB manufacturer

23/09/2026

| Part 3.1. Why Brown Oxidation?

Why do we need to treat the copper surface before lamination? 👀

Brown oxidation helps to:
• Roughen the copper surface for better resin bonding.
• Improve resin wetting and bonding.
• Protect the copper surface during lamination.

A small step, but an important one for reliable layer bonding.

21/09/2026

| Part 3. Lamination

After the inner layer process, the next step is lamination — where copper foil, prepreg, and oxidation-treated inner-layer circuit boards are brought together under heat and pressure to form the PCB structure.

The main process includes:
Brown Oxidation → Riveting (Pre-stacking) → Lay-up → Lamination → X-Ray Target Drilling → Routing → Edge Grinding

A few snapshots from our lamination process. 👀

18/09/2026

| Part 2. Inner Layer Process — AOI

Here’s a quick look at the AOI equipment used in our inner layer process. 👀

16/09/2026

| Part 2. Inner Layer Process — DES

We’ve already looked at the general flow of the Inner Layer Process. Now, let’s take a quick look at one of its key stages — DES:
Developing → Etching → Stripping

Let’s follow the camera and take a quick look at the equipment running this process on the production floor. 👀

14/09/2026

A new milestone ✨

This September, Jiangxi Global Success Circuits was recognized as a 2025 Annual Progressive Enterprise by the Shangli County government.

This recognition means a lot to our team and reflects the steady growth and progress we’ve made together.

Thank you to our team and partners around the world for being part of the journey. We’ll keep moving forward, with the same focus on quality and reliable PCB production.

11/09/2026

Inner Layer Cleanroom.
A glimpse into the controlled environment where our inner-layer processes take place.

10/09/2026

🎥 Take a closer look at our inner-layer pre-treatment.

07/09/2026

07/09/2026

| Part 2: Inner Layer Process

How does a full copper surface become a precise circuit pattern?
It starts with: Pre-treatment → Applying Dry Film → Exposure → Development → Etching → Film Stripping → AOI

The process uses chemical etching to remove unwanted copper, leaving behind the designed circuit pattern on the inner layer. But the process doesn’t stop there.

After etching, AOI scans the panels for potential defects, followed by VRS manual verification and repair where needed.

From forming the circuit to inspecting every detail, each step matters in achieving reliable inner-layer quality.

🎥 Take a closer look at our inner-layer process.

05/09/2026

| Part 1: Laminate Cutting
From laminate to working panels - see the process in action. 🎥