CSMH

Name: CSMH
Address: No. 253 Guankou Avenue, Jimei District, Xiamen City, Xiamen, 360000, CN
Telephone: +8613616001136

Home
China
Xiamen
CSMH

CSMH Semi is a Wide Bandgap Semiconductor Material and Device Manufacturer.

20/08/2026

From Material to Package: Diamond on Si for 2.5D/3D

As 2.5D/3D advanced packaging pushes chip density and heat flux to new limits, thermal management is becoming a critical bottleneck for next-generation AI computing.

At CSMH, we believe the key is not asking semiconductor manufacturing to adapt to a new material, but engineering the material to fit existing processes.

Our Diamond on Si technology combines diamond’s exceptional thermal conductivity with silicon’s semiconductor compatibility, providing a practical pathway for faster adoption and engineering-scale mass production in advanced packaging.

By bridging the gap between extreme thermal performance and established semiconductor processes, CSMH is helping move diamond cooling from a high-performance material to a scalable thermal solution for 2.5D/3D packaging.

Interested in learning more or exploring potential applications? Connect with us—we’d be glad to discuss.

#2.5D/3DPackaging

31/07/2026

Diamond Copper + Liquid Cooling: The Next-Generation Standard Thermal Solution for AI GPUs

Traditional copper and air cooling methods have reached their physical limits. The industry has long believed that using diamond copper for near-end cooling and liquid cooling for system-level cooling can significantly improve thermal efficiency. Actual testing shows that diamond can reduce GPU junction temperatures by 15-22°C, increasing computing power per watt by 12-18%; furthermore, for every 10°C reduction in junction temperature, chip lifespan doubles, significantly reducing replacement costs in data centers.

CSMH has launched a diamond copper composite material with a thermal conductivity of 600-1000 W/(m·K). Its coefficient of thermal expansion can be precisely adjusted to match silicon chips, offering core advantages such as high performance, cost-effectiveness, and ease of mass production. This product can be processed into various forms, including diamond copper spade teeth, liquid cooling plates, chip carriers, and package covers, to meet the needs of various application scenarios.

Please feel free to contact us with any questions or needs.
Copper cooling chip cooling

28/07/2026

CSMH possesses excellent micro/nano fabrication capabilities. For AFM equipment, we offer high-quality probes. These probes offer the following advantages:
Deep-Trench Profiling: Specifically engineered for measuringhigh-aspect-ratio trenches and vertical,steep sidewalls accurately with minimalimage distortion.
Ultra-Sharp Tip GeometryAvery small half-cone angle(~5°)yields asignificantly smaller tip radius,greatly im-proving lateral scan resolution.
Extended Operational Lifetime: The conical structure with a half-coneangle

17/07/2026

Chip cooling is a critical challenge in the high-compute era. CSMH’s self-developed Diamond-on-Si thermal solution utilizes revolutionary materials and features an innovative Si-on-Si bonding design framework, which efficiently lowers junction temperatures for HPC, data center and AI hardware, resolving overheating issues on GPUs and AI chips.

, , , ,

03/07/2026

At CSMH, we've turned efficient chip cooling from concept into reality ⚛️🔥

Our innovative Diamond on Si technology achieves groundbreaking heat dissipation performance through innovations in engineering materials and bonding techniques.

This solution, with its proprietary patented technology, has been verified by global GPU/CPU partners, significantly reducing chip junction temperature and possessing superior heat dissipation capabilities. Mass production has now commenced. 🚀

We have achieved industry-leading performance through three core technological breakthroughs:

- ✅ Materials Engineering: Our self-developed specialized growth equipment enables the production of ultra-large-size, uniform, and adjustable interfacial thermal resistance Diamond on Si films.

- ✅ Bonding Innovation: Redefining Diamond-Si integration, we employ low-complexity Si-Si bonding technology to construct unobstructed and highly efficient heat conduction channels.

- ✅ Packaging Optimization: Customizable Diamond-si stack structures in size/thickness match the semiconductor's coefficient of thermal expansion, alleviating thermal coupling in 2.5D/3D stack architectures.

Leveraging cross-regional patents and an intelligent end-to-end manufacturing chain🏭, this engineered thermal solution can be extended to high-temperature applications such as AI PC, AI chips, and data centers.

Want to learn more? Contact us.
PC # on Si

01/07/2026

Diamond is the ultimate thermal management material, with thermal conductivity reaching up to 2200 W/(m·K). But measuring that extreme performance accurately? That‘s where things get challenging.
Unlike conventional methods, our TDTR uses a non-contact optical pump-probe technique that measures thermal properties through surface reflectivity changes. It delivers precise, reliable data for ultra-high thermal conductivity materials — including diamond, SiC, and nanoscale films — across a measurement range of 1–2200 W/(m·K).Curious about how TDTR can help with your diamond or advanced material testing? Let‘s connect — I’d love to chat.

Address

No. 253 Guankou Avenue, Jimei District, Xiamen City
Xiamen
360000

Telephone

+8613616001136

Website

http://en.csmh-semi.com/, http://www.csmh-semi.com.cn/

Alerts

Be the first to know and let us send you an email when CSMH posts news and promotions. Your email address will not be used for any other purpose, and you can unsubscribe at any time.

Contact The Business

Send a message to CSMH:

Want your business to be the top-listed business in Xiamen?