28/08/2026
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๐จ๐ซ๐ฆ๐ง๐๐ฑ๐ญ ๐๐ก๐๐ง๐ณ๐ก๐๐ง๏ฝ๐ ๐๐จ๐จ๐ค ๐๐ง๐ฌ๐ข๐๐ ๐ญ๐ก๐ ๐๐๐๐๐๐๐ ๐๐จ๐จ๐ญ๐ก
At Formnext Shenzhen, RESIONE made its first showcase of our latest elastomer materials ร production-grade E1 3D printer, presenting a more complete 3D printing elastomer solution. We also previewed upcoming high-performance materials, including ABS+ engineering resin and EP01 high-transparency earphone resin, alongside a selection of established resin products covering model making, functional prototyping, and end-use applications.
RESIONE continues to advance the integration of 3D printing materials and equipment, offering more options for different applications. The booth also welcomed many industry professionals for discussions on the future of 3D printing technology and applications.
Thank you to everyone who visited us at Booth D172. See you next time!