X-FAB

Name: X-FAB
Address: HaarbergStr. 67, Erfurt, 99097, DE
Telephone: +493614276162
Price range: Not Applicable

X-FAB is the leading foundry group manufacturing silicon wafers in More-than-Moore technologies. (HRB) 111661

USt-Id Nr.: DE 150 116 921

As the world's leading foundry group for analog/mixed-signal semiconductor applications, X-FAB creates a clear alternative to typical foundry services by combining solid, specialized expertise in advanced analog and mixed-signal process technologies with excellent service, a high level of responsiveness and first-class technical support. X-FAB manufactures wafers for automotive, industrial, consum

er, medical, and other applications. With its six manufacturing sites in Germany, France, Malaysia and the USA, X-FAB employs approx. 4,200 employees worldwide. Imprint:
X-FAB Semiconductor Foundries GmbH
Haarbergstr. 67
99097 Erfurt
Germany

p +49-361-427 60 00
f +49-361-427 61 11
e [email protected]
w www.xfab.com

Managing Director: Dr. Gabriel Kittler
Registered at Amtsgericht Jena; No.

15/06/2026

✨Giving back starts with showing up.🤝
On June 5, our X-FAB Texas team came together for a Day of Caring at the Guadalupe-Parkway Sommerville Center.

With 20 dedicated volunteers, it turned into a truly amazing day.✨It was a chance to connect with local children and create a day filled with food, games, laughter and teamwork. 🫶🏼🤩
👉🏼What started as a volunteering event became a clear reminder of the immense power that comes from giving time, energy and attention to communities around us. 👥

Our Employee Engagement Committee deserves special thanks for organising this event. All our volunteers showed great energy, kindness and a heart for giving back. ❤️

We are proud to be part of a team that continues to make an impact beyond the fab. 🫰🏼

28/05/2026

[Press Release] X-FAB and Cadence Strengthen Collaboration to Streamline Design Migration Across Nodes

We have expanded our long-standing collaboration with Cadence to deliver a streamlined and highly automated approach to design migration across semiconductor process nodes. The joint solution combines X-FAB’s process expertise and PDKs with the advanced capabilities of Cadence’s Virtuoso Studio design migration technology, enabling customers to transition designs quickly, efficiently, and confidently.

“With the PDK support of Cadence Virtuoso Studio design migration, we enable our customers to transition smoothly between technologies,” said Melanie Wilhelm, Design Technology Manager at X-FAB. “The approach allows us to deliver a highly efficient and reliable migration path. The X-FAB engineering team is committed to providing this level of support, helping customers stay agile and responsive in an increasingly demanding market landscape.”

“Design migration is becoming a strategic priority for semiconductor companies navigating technology evolution, supply chain issues, and geopolitical challenges,” said Ashutosh Mauskar, Corporate Vice President of Custom Products Group at Cadence. “Our continued collaboration with X-FAB reflects a shared commitment to delivering robust, scalable solutions that simplify migration and support our customers’ long-term innovation roadmaps.”

Read the full press release here: 👇
https://lnkd.in/d3iR5ptm

13/05/2026

Four events on two continents 🌎 ✈️! From May 5 to 12, X‑FAB colleagues have been travelling the world, presenting our specialty technologies, connecting with our communities and engaging with new partners.

The journey started in Erfurt, Germany at 💫 Quantum Photonics, exploring the potential of photonics to transform the next‑generation of computing and communication. At the same time, our team joined 💫 Sensors Converge in Santa Clara, USA to discuss the technologies enabling smarter and more connected systems. In Munich, Germany, we came together with the IC design community at 💫 CadenceCONNECT and 💫 U2U Siemens for insights and exchanges on EDA tools and design flows.

💡 Across all four events, one message was clear: working together and sharing our expertise really helps us innovate more quickly.

🙏🏻 A big thank you to everyone who connected with us, challenged us, and shared their perspectives.

07/05/2026

High-mix semiconductor manufacturing is complex. 🎯 What if we could push prediction further and reduce remaining uncertainty?
At apc|m Europe, three X-FAB colleagues presented their perspectives on this challenge.

💭 Rethinking established models
Do operating curves still hold in high-mix fabs? Christian Schirrmann and Gero Grau’s analysis showed: reality is far more complex and variability reduction is the key driver.

🤖 From guesswork to machine learning
Traditional approaches struggle with constantly changing product designs. By combining Run-to-Run control with machine learning, Beatrice Beyer demonstrated how we can predict polishing times before the first wafer is processed and safe time and afford in high mix fabs.

🔬 Smarter monitoring in the fab
Integrating advanced sensors into our fault detection and classification (FDC) systems helps detect issues like oxygen contamination early. Martin Stoll illustrated how to improve process control and yield.

High-mix fabs challenge many established assumptions. ➡️ Where do you currently see the biggest gap between theory and fab reality? Is it modeling, variability, or the limits of available data?

05/05/2026

First‑time‑right doesn’t happen by chance. 🍀

In analog, mixed‑signal and high‑voltage designs, success is rarely about a single tool. As Lars Bergmann, Director Business Development and former Head of Design Support, puts it: “What really drives first‑time‑right is alignment between technology, PDK quality and the EDA design flow/ecosystem which designers actually use every day.”

That’s why our experts are engaging face‑to‑face with the design community in Munich, Germany this May exchanging experiences, not just presentations.

Meet us at:
📍 CadenceCONNECT - May 6
📍 Siemens EDA User2User Europe - May 12

If you’re there, let’s talk design enablement, PDK quality and first‑time‑right methodology. And do not miss Robin Wetzler's speaker slot on robust memory design on May 12, 11.45 a.m.

04/05/2026

X-FAB will participate in Quantum Photonics in Erfurt on May 5-6, 2026! 🚀

Visit us at booth no. 2/711.

🎤 Don’t miss our technical talk:
Alexander Zimmer, Member Technical Staff-Optical Sensors:
👉🏼“Integrated CMOS SPAD enabling low‑cost Quantum Communication systems”
📅 May 6, 2026 |⏰4:00 p.m.

See you in Erfurt!🤩

01/05/2026

Behind every chip, there’s a team. 💙

On International Labor Day, we’re celebrating the people who make X‑FAB possible - across our fabs and offices worldwide. From wafer manufacturing and process engineering to facilities, technology and corporate teams: Thank you for your commitment, skills, and teamwork.

Happy Labor Day! ✊🏻

30/04/2026

X-FAB published its financial results for the first quarter 2026.
Find the press release here: www.xfab.com/investors

28/04/2026

🔍 Sensing the real world at Sensors Converge 2026!

We’re excited to be exhibiting at Sensors Converge 2026, where we’ll showcase how we combine CMOS, MEMS, and advanced packaging technologies to enable high‑performance sensor solutions across a wide range of applications.

Discover our capabilities in:

• CMOS & MEMS sensor platforms
• Heterogeneous integration (wafer bonding, TSV, micro‑transfer printing)
• Optical, magnetic, inertial, pressure, gas, flow, and temperature sensing
• Advanced materials: GaN, AlN, photonics, noble metals, and glass

📍 Santa Clara Convention Center, booth no. 621
📅 May 5–7, 2026

Visit us at booth no. 621 to explore how our manufacturing platforms support reliable, scalable sensor solutions - from industrial and medical to automotive and consumer applications.

👉 Learn more: https://www.xfab.com/news/details/article/sensors-converge-2026

Use code 10077 for a FREE Expo Hall Pass. 🎟️

Adresse

HaarbergStr. 67
Erfurt
99097

Telefon

+493614276162

Webseite

http://xfab.com/

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