ERS electronic GmbH

ERS electronic GmbH ERS is a customer-centred firm that has been walking side by side with its customers to achieve their business goals since 1970.

ERS has been supplying innovative thermal test solutions to the semiconductor industry since 1970 and is famous for fast-ramping and precise low-noise thermal systems (-65°C to +500°C) for analytical, parametric and wafer sort probing up to 300mm. The patented ERS flagship product for hot/cold wafer test, AC3(R), is available for package-level tri-temp applications for MEMS test. ERS designs and b

uilds stand-alone thermal-forcing systems and custom production tools for difficult thermal applications. ERS supplies the advanced wafer level packaging market with its fully automatic debonders and warpage adjust tools used in the production of both 200mm and 300mm eWLB device packages. On a broader scale, ERS supports not only eWLB but many other Fan-Out Wafer-Level-Package (FOWLP) technologies with its factory competence center that opened in March 2011. ERS has its headquarters, sales department, engineering center and production facilities in the Munich suburb of Germering, and has support offices in the US, Singapore and Taiwan. ERS liefert seit 1970 innovative thermische Testlösungen für die Halbleiterindustrie und ist bekannt für schnelle und präzise geräuscharme thermische Systeme (-65 ° C bis + 500 ° C) für analytische, parametrische und Wafer-Sortierung bis 300 mm . Das patentierte ERS Flaggschiffprodukt für den Heiß / Kalt-Wafertest, AC3 (R), ist für Tri-Temp-Anwendungen auf Gehäuseebene für MEMS-Tests verfügbar. ERS konstruiert und fertigt stand-alone Thermo-Forcing-Systeme und kundenspezifische Produktionswerkzeuge für schwierige thermische Anwendungen. ERS beliefert den Markt für hochentwickelte Waferlevel-Packages mit vollautomatischen Debondern und custom production tools, die bei der Herstellung von eWLB-Gehäusepaketen für 200 mm und 300 mm verwendet werden. Auf breiterer Ebene unterstützt ERS nicht nur die eWLB, sondern auch viele andere Fan-Out-Wafer-Level-Package-Technologien (FOWLP) mit seinem im März 2011 eröffneten Factory-Kompetenzzentrum. ERS hat seinen Hauptsitz, seinen Vertrieb, sein Technikzentrum und seine Produktionsstätten in dem Münchner Vorort Germering, und hat einen Vertrieb in den USA, Singapur und Taiwan.

19/06/2026

AI infrastructure is causing a significant increase in electricity demand, accelerating the adoption of SiC and GaN technologies across data centre power conversion, grid interconnection, and renewable energy systems. Many of these wide-bandgap devices operate at voltage and current levels that require specialized high power wafer test solutions. The ERS High Voltage/Current Chuck is built for exactly this test scenario: ultra-low leakage, low inductance for dynamic power tests, and safe thin-wafer autoloading for thinned substrates increasingly common in power device fabrication.

Get in touch with our experts at [email protected] to learn more!

Next week, from June 17–19, meet our Regional Sales Manager at the SEMI 3D & Systems Summit in Dresden — the heart of Ge...
10/06/2026

Next week, from June 17–19, meet our Regional Sales Manager at the SEMI 3D & Systems Summit in Dresden — the heart of Germany's "Silicon Valley" for semiconductors.

Let's exchange insights on the latest trends and challenges in hashtag and discuss how ERS solutions support next-generation semiconductor manufacturing.

Looking forward to seeing you in Dresden!

The shift from final test to wafer-level test is well underway, but the industry continues to face challenges in probing...
09/06/2026

The shift from final test to wafer-level test is well underway, but the industry continues to face challenges in probing next-generation devices, including AI and memory chips, silicon photonics, and high power ICs. Our CTO, Americas Sales Manager, and China General Manager are in Carlsbad this week for SWTest, exchanging insights with industry peers on the future of wafer testing.

If you're attending SWTest and would like to discuss thermal management, high power dissipation, low leakage testing, or wide temperature wafer probing, let's connect!

🚀 SWTest San Diego is just around the corner! Next week, our CTO, Americas Sales Manager, and China General Manager will...
02/06/2026

🚀 SWTest San Diego is just around the corner! Next week, our CTO, Americas Sales Manager, and China General Manager will be in Carlsbad, ready to share insights and discuss the latest trends and challenges in from a global perspective.

Don’t miss this opportunity to exchange ideas with us and explore the technologies driving the next generation of wafer testing for accelerators, , and high-parallelism applications!

A big thank you to everyone who visited us at IEEE ECTC 2026 🚀 Over the course of the event, we had many insightful and ...
28/05/2026

A big thank you to everyone who visited us at IEEE ECTC 2026 🚀 Over the course of the event, we had many insightful and engaging discussions with customers, partners, and conference participants about the latest challenges and innovations in advanced packaging.

Special thanks to Global Advanced Packaging for the wonderful interview with our Product Marketing Manager, Evelyn Weng — connecting solution seekers with our wafer- and panel-level warpage correction and debonding technologies.

As the event is coming to an end, don’t miss your last chance to meet us at Booth 413!

From June 8–10, our CTO and American Sales will be attending SWTest San Diego in Carlsbad. Schedule a personal meeting w...
21/05/2026

From June 8–10, our CTO and American Sales will be attending SWTest San Diego in Carlsbad. Schedule a personal meeting with them to discuss wide-temperature, low-leakage, high power dissipation solutions for AI chips, , , and high-parallelism DRAMs. Contact us at [email protected].

19/05/2026

With its area-exposure design, the PhotoThermal debonder LumosON can handle a wide range of substrates and materials, including deformed and broken or . It’s becoming an almost perfect solution for higher throughput and the lowest cost of ownership. Want to learn more about LumosON? Watch this video and hear our Product Marketing Manager Evelyn explain how it works!

Plus, Evelyn and our American sales Bernd will be attending IEEE ECTC next week! Schedule a meeting with them at [email protected] to discuss your debonding and handling needs.

In less than two weeks, our American Sales and Product Marketing Manager are heading to ECTC 2026. Stop by our Booth 413...
13/05/2026

In less than two weeks, our American Sales and Product Marketing Manager are heading to ECTC 2026. Stop by our Booth 413 and let’s discuss debonding and warpage solutions for maximum yield.

As SEMICON SEA comes to a close, our next stop is already waiting: ECTC 2026! From May 26–29, visit us at Booth 413 and ...
07/05/2026

As SEMICON SEA comes to a close, our next stop is already waiting: ECTC 2026! From May 26–29, visit us at Booth 413 and discuss our advanced packaging solutions engineered for TBDB (temporary bonding and debonding) and warpage management. Look forward to seeing you soon in Orlando!

Adresse

Stettiner Str. 3+5
Germering
82110

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