ERS electronic GmbH

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ERS electronic GmbH ERS is a customer-centred firm that has been walking side by side with its customers to achieve their business goals since 1970.

ERS has been supplying innovative thermal test solutions to the semiconductor industry since 1970 and is famous for fast-ramping and precise low-noise thermal systems (-65°C to +500°C) for analytical, parametric and wafer sort probing up to 300mm. The patented ERS flagship product for hot/cold wafer test, AC3(R), is available for package-level tri-temp applications for MEMS test. ERS designs and builds stand-alone thermal-forcing systems and custom production tools for difficult thermal applications. ERS supplies the advanced wafer level packaging market with its fully automatic debonders and warpage adjust tools used in the production of both 200mm and 300mm eWLB device packages. On a broader scale, ERS supports not only eWLB but many other Fan-Out Wafer-Level-Package (FOWLP) technologies with its factory competence center that opened in March 2011. ERS has its headquarters, sales department, engineering center and production facilities in the Munich suburb of Germering, and has support offices in the US, Singapore and Taiwan. ERS liefert seit 1970 innovative thermische Testlösungen für die Halbleiterindustrie und ist bekannt für schnelle und präzise geräuscharme thermische Systeme (-65 ° C bis + 500 ° C) für analytische, parametrische und Wafer-Sortierung bis 300 mm . Das patentierte ERS Flaggschiffprodukt für den Heiß / Kalt-Wafertest, AC3 (R), ist für Tri-Temp-Anwendungen auf Gehäuseebene für MEMS-Tests verfügbar. ERS konstruiert und fertigt stand-alone Thermo-Forcing-Systeme und kundenspezifische Produktionswerkzeuge für schwierige thermische Anwendungen. ERS beliefert den Markt für hochentwickelte Waferlevel-Packages mit vollautomatischen Debondern und custom production tools, die bei der Herstellung von eWLB-Gehäusepaketen für 200 mm und 300 mm verwendet werden. Auf breiterer Ebene unterstützt ERS nicht nur die eWLB, sondern auch viele andere Fan-Out-Wafer-Level-Package-Technologien (FOWLP) mit seinem im März 2011 eröffneten Factory-Kompetenzzentrum. ERS hat seinen Hauptsitz, seinen Vertrieb, sein Technikzentrum und seine Produktionsstätten in dem Münchner Vorort Germering, und hat einen Vertrieb in den USA, Singapur und Taiwan.

How is Europe shaping the future of AI and semiconductor innovation? Join us at SEMI Europe and electronicaFair 2026, fr...
21/10/2026

How is Europe shaping the future of AI and semiconductor innovation?

Join us at SEMI Europe and electronicaFair 2026, from November 11–13 in Munich!

As AI, mobility, robotics, and power infrastructure advance, so does the need for innovative semiconductor technologies. At ERS, we support this progress with our hashtag and hashtag equipment.

Join us at booth #1356 to exchange insights and discuss industry challenges!

Thank you to TEEIA 台灣電子製造設備工業同業公會 for the invitation! We’re delighted to be among the speakers at the November 5 forum i...
19/10/2026

Thank you to TEEIA 台灣電子製造設備工業同業公會 for the invitation! We’re delighted to be among the speakers at the November 5 forum in Taipei. Our Product Marketing Manage will be presenting on the topic of control at the upcoming forum.

Building on our thermal management expertise, we have developed a patented contactless transport technology featuring three temperature-controllable chuck stations. This technology has been integrated into our advanced packaging equipment and recognized by the industry.

As formats grow and packaging architectures become increasingly complex, warpage control continues to evolve. At ERS, we keep developing advanced solutions to meet these emerging challenges.

Join our presentation to learn more about how we tackle warpage challenges in advanced packaging. We look forward to exchanging insights with you in Taipei!

From November 5 – 6, join us in Hsinchu to discuss power and temperature wafer probing solutions for next-generation HPC...
14/10/2026

From November 5 – 6, join us in Hsinchu to discuss power and temperature wafer probing solutions for next-generation HPC, AI, memory chips, and more. We look forward to seeing you at SWTest Asia 2026 in Taiwan!

Where can you meet us next? 🌎 In the final quarter of this year, we’ll be attending advanced packaging and wafer probing...
01/10/2026

Where can you meet us next? 🌎

In the final quarter of this year, we’ll be attending advanced packaging and wafer probing events around the world. SEMICON West 2026 will be our first stop in Q4.
📅 October 13–15
📍 San Francisco | Moscone Center
Come meet our colleagues in the South Hall at booth #1973!

Panel-level packaging is moving from pilot to production, and with it, the demands on process integration are rising.Our...
30/09/2026

Panel-level packaging is moving from pilot to production, and with it, the demands on process integration are rising.

Our new fully automated system brings temporary carrier bonding, debonding, and detaping together in a single 310×310 mm platform, designed for dual-carrier backside processing in 2.5D/3D IC, HBM, and chip stacking workflows.

Why does integration matter? Every panel transfer between tools introduces handling risk, thermal variation, and potential yield loss. Consolidating three process steps eliminates those transitions entirely.

Built on 55 years of thermal management expertise and more than 30 years of machine-building capability. The first unit has already been delivered to a leading semiconductor manufacturer.

Read the full announcement here: https://www.ers-gmbh.com/automated-plp-system

Happy Mid-Autumn Festival! Wishing our colleagues, customers, partners, and friends who celebrate the Mid-Autumn Festiva...
25/09/2026

Happy Mid-Autumn Festival! Wishing our colleagues, customers, partners, and friends who celebrate the Mid-Autumn Festival a joyful day filled with happiness, togetherness, and bright moments.

We’re attending SEMICON West 2026! Join us October 13–15 at Booth  #1973 at the Moscone Center in San Francisco.Come by ...
22/09/2026

We’re attending SEMICON West 2026! Join us October 13–15 at Booth #1973 at the Moscone Center in San Francisco.

Come by to exchange insights on the latest developments and challenges shaping the semiconductor industry. We look forward to connecting with you in San Francisco!

SEMICON India 2026 is underway 📢 Our colleague is ready to connect at Booth  #366. Come by and let’s talk about the late...
18/09/2026

SEMICON India 2026 is underway 📢 Our colleague is ready to connect at Booth #366. Come by and let’s talk about the latest in wafer probing and advanced packaging solutions. See you at the show!

17/09/2026

In our latest ERS TechTalk, Design Engineer Tony breaks down how our Ultra Low Noise (ULN) Chuck Systems eliminate leakage current, EMI, and thermal noise during Wafer Acceptance Testing.

Key features of the ULN Chuck:
🔸Ultra-Low Leakage: < 2.5 fA/V @ 25°C
🔸Isolation: Superior stability for characterisation and in-line testing
🔸Connections: Native Kelvin triaxial support
🔸Compatibility: Keysight, Keithley, Rohde & Schwarz, and NI

Tony is currently attending SEMICON India. Meet him at our channel partner GMS's Booth #366 to learn more about our latest wafer probing solutions.

Last day of the IS Test Workshop! It was a great opportunity to connect with industry pioneers in Munich and exchange id...
15/09/2026

Last day of the IS Test Workshop! It was a great opportunity to connect with industry pioneers in Munich and exchange ideas on the latest developments and challenges in wafer probing. A big thank you to the organizers, and we look forward to seeing everyone again next year.

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Stettiner Str. 3+5
Germering
82110

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