T-Global Technology Europe and North America Ltd

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T-Global Technology Europe and North America Ltd T-Global Technology is a leading supplier of advanced thermal management solutions. We offer design support, rapid sampling and full engineering support.

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T-Global Technology are delighted to be returning to Stuttgart from 10–12 November 2026 for Thermal Management Expo.Come...
15/10/2026

T-Global Technology are delighted to be returning to Stuttgart from 10–12 November 2026 for Thermal Management Expo.

Come and meet the team at Stand 937 to discover how our thermal management solutions can help improve performance, efficiency and reliability across your applications.

Here’s what you can look forward to:

· Explore our range of high-performance thermal interface materials (TIMs), thermal management systems and modules.

· Get hands-on with our products and pick up a FREE thermal interface material sample box.

· Discuss your technical challenges and upcoming projects directly with our engineering team.

· Discover our bespoke, custom-engineered solutions, tailored to meet your application requirements.

Whether you’re tackling a complex thermal challenge, developing next-gen electronics or looking for a trusted partner for your next project, we’d love to talk.

Registration is free, find out more about the event and plan your visit via: https://www.tglobaltechnology.com/2026/10/01/t-global-technology-returns-to-thermal-management-expo-europe-2026/

T-Global Technology's TG-AM100 Thermal Pad boasts the lowest thermal impedances in our silicone pad range with a thermal...
12/10/2026

T-Global Technology's TG-AM100 Thermal Pad boasts the lowest thermal impedances in our silicone pad range with a thermal conductivity of 10.0 W/mK measured via Hotdisk (ISO 22007-2).

Reliable electrical insulation properties, high compressibility and conformability (40 Shore 00) ensures suitability for the most demanding thermal management applications.

Designed for high-power and high-density electronics, TG-AM100 provides effective thermal management for a range of industry applications including AI and HPC systems, servers, power electronics, EV and automotive electronics, 5G infrastructure and networking equipment.

TG-AM100 is V-0 flame rated with an operating temperature range of -50°C to +150°C and is supplied in thicknesses from 1.0 mm to 5.0 mm, giving designers greater flexibility when accommodating different component heights and interface requirements.

Key features:

• 10.0 W/mK thermal conductivity
• 40 Shore 00 hardness for effective gap filling
• Dielectric breakdown voltage ≥4 kV/mm
• UL94 V-0 flame rating
• Operating temperature range of −50°C to +150°C
• Available in 1.0–5.0 mm thicknesses, as sheets or cut parts
• RoHS and REACH compliant

https://www.tglobaltechnology.com/2026/10/08/tg-am100-thermal-pad-launched/

T-Global Technology simplifies thermal management at every stage of the design cycle. Whether you need to reduce interfa...
01/10/2026

T-Global Technology simplifies thermal management at every stage of the design cycle.

Whether you need to reduce interface resistance, spread heat, or protect temperature-sensitive components, we provide the flexible solutions your project demands.

Our complete online portfolio allows you to easily filter and compare core materials by critical parameters including format, thermal conductivity, and dielectric breakdown voltage so you can quickly identify the right candidates for prototyping.

Why choose T-Global Technology?

- Comprehensive Product Range: From thermal pads, putties, and pastes to heat sinks, v***r chambers, and cooling chips.

- Flexible Sourcing: Benefit from no minimum order quantities (MOQ), custom design options, and worldwide shipping.

- Seamless Scalability: Move confidently from initial evaluation straight into full production.

Explore our product categories and start shortlisting materials for your next project via: https://www.tglobaltechnology.com/products/product-categories/

What is ASTM E595?ASTM E595 is the internationally recognised test method used to determine the outgassing characteristi...
04/08/2026

What is ASTM E595?

ASTM E595 is the internationally recognised test method used to determine the outgassing characteristics of materials exposed to high vacuum environments.

ASTM E595 was developed in response to the need to control molecular contamination on spacecraft. During the 1970s, NASA increasingly recognised that spacecraft and satellites had to be designed with outgassing risks in mind, particularly for materials used in high-vacuum environments where even trace contamination could compromise performance.

The standard established a consistent method for evaluating the outgassing characteristics of materials, helping determine whether they were suitable for use in contamination-sensitive applications.

The procedure measures:

- Total Mass Loss (TML)
- Collected Volatile Condensable Material (CVCM)
- Water Vapour Regained (WVR)

These measurements allow engineers to compare materials based on their tendency to release volatile compounds under vacuum conditions.

Find out more about the standard and our low outgassing thermal pads here: https://www.tglobaltechnology.com/2026/07/29/what-is-astm-e595/

Our latest newsletter has just landed!If you're involved in thermal management or electronic design, this edition is ful...
30/07/2026

Our latest newsletter has just landed!

If you're involved in thermal management or electronic design, this edition is full of practical insights, industry updates and technical guidance to help you to stay ahead.

This issue includes:

- Our latest product launch for our highest thermally conductive adhesive tape to date

- How effective thermal management is supporting the next generation of server applications

- An introduction to ASTM E595 and why it's relevant far beyond the aerospace industry

- A straightforward guide to thickness and dimensional tolerances to help you select the right thermal solution for your next design

Read the latest issue online here: https://email.tglobaltechnology.com/t-global-technologys-newsletter-7 or subscribe to receive future editions straight to your inbox via: https://www.tglobaltechnology.com/newsletter-sign-up/

Introducing TG-T1002 Thermal Tape: T-Global Technology’s highest thermal conductivity adhesive tape.Designed to support ...
23/07/2026

Introducing TG-T1002 Thermal Tape: T-Global Technology’s highest thermal conductivity adhesive tape.

Designed to support efficient heat transfer and secure components without mechanical fasteners, TG-T1002 delivers 2.1 W/mK thermal conductivity alongside low thermal impedance of 0.84 °C·in²/W at 30 psi, helping engineers improve cooling performance in demanding electronic applications.

With strong adhesion, long-term reliability, and custom die-cut options available, TG-T1002 is ideal for applications including LED modules, display panels, power supplies, IC chips, MOSFETs, routers, network equipment, and heat sink assemblies.

Find out more about TG-T1002 and explore how T-Global Technology can support your next thermal management challenge via https://www.tglobaltechnology.com/2026/07/22/tg-t1002-thermal-tape-launched/

Our latest newsletter has just landed!If you're working in thermal management or electronic design, this edition is pack...
02/07/2026

Our latest newsletter has just landed!

If you're working in thermal management or electronic design, this edition is packed with practical insights to help you stay ahead.

Inside you'll find:

- An introduction to our new ASTM E595-certified TG-AD30D thermal pad
- Key industry applications for display panels
- An important NRND update for one of our thermal tapes
- A simple thermal pad selection guide to help you choose the right solution for your next project

Read the latest issue online here: https://bit.ly/4wHg64z or subscribe to receive future editions direct to your inbox via https://bit.ly/4eWPcOP

As Europe experiences another record-breaking heatwave, it's a reminder that heat isn't just a challenge for people, it'...
26/06/2026

As Europe experiences another record-breaking heatwave, it's a reminder that heat isn't just a challenge for people, it's one of the biggest issues facing modern electronics.

From AI servers and EV power electronics to industrial automation and telecommunications, higher operating temperatures can reduce performance, shorten component lifespan and impact long-term reliability.

With ambient temperatures rising, effective thermal management becomes even more critical. Recent heat records across the UK and Europe have highlighted how extreme temperatures are increasingly affecting infrastructure and technology alike.

That's where thermal interface materials (TIMs) play a vital role.

By efficiently transferring heat away from critical components, high-performance TIMs and next-gen thermal management solutions help engineers maintain system reliability, improve efficiency and support longer product lifecycles, even in demanding environments.

At T-Global Technology, we work with customers across a range of industries to solve complex thermal challenges through a comprehensive range of thermal management solutions, including thermal pads and putties, phase change materials, v***r chambers, heat spreaders and more.

Find out more about our full product range here: https://www.tglobaltechnology.com/products/product-categories/

Introducing TG-AD30D Low Outgassing Thermal Pad:T-Global Technology is pleased to announce the launch of the new TG-AD30...
08/06/2026

Introducing TG-AD30D Low Outgassing Thermal Pad:

T-Global Technology is pleased to announce the launch of the new TG-AD30D, an advanced low-outgassing thermal pad designed for applications where thermal performance, reliability, and material stability are critical.

Engineered to ASTM E595 standards for demanding applications across aerospace, AI infrastructure, datacom, automotive electronics, energy storage, military systems, and advanced industrial equipment, TG-AD30D helps manufacturers address thermal challenges without compromising long-term system reliability.

With a thermal conductivity of 3.0 W/mK, low thermal impedance and excellent electrical insulation properties, TG-AD30D is optimised for high-power applications requiring efficient heat transfer and dependable mechanical compliance with minimal outgassing.

TG-AD30D extends our hybrid thermal pad portfolio with a material specifically developed for applications where outgassing performance is a major design consideration, this product enables customers to achieve reliable thermal management in increasingly sensitive and high-performance electronic systems.

Find out more: https://www.tglobaltechnology.com/2026/06/03/low-outgassing-thermal-pad-launched/

Our latest newsletter has just landed!Highlights include details on our latest product launch for our best in class rein...
29/05/2026

Our latest newsletter has just landed!

Highlights include details on our latest product launch for our best in class reinforced thermal pad TG-A9000F, details on how to access our thermal simulation service, the last chance to secure your free tickets to Hardware Pioneers Max, and a showreel for our TG-AD hybrid thermal pad series.

To view the latest issue or sign up for future editions check out the links below:

View the latest edition here: https://email.tglobaltechnology.com/t-global-technologys-newsletter-5

Sign up here: https://www.tglobaltechnology.com/newsletter-sign-up/

Address

Lutterworth

Opening Hours

Monday 9am - 5pm
Tuesday 9am - 5pm
Wednesday 9am - 5pm
Thursday 9am - 5pm
Friday 9am - 5pm

Telephone

+441455553510

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